InfineTechnologies

Highest efficiency is a key requirement for today’s power electronics. With this in mind, Infineon Technologies AG is introducing its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate-driver family in a compact form factor. The gate-driver family comes in an 8mm wide-body package to ensure easy design-in and integrates a two-level, slew-rate control, which significantly improves…

Infineon Technologies AG has upgraded its EasyDUAL CoolSiC MOSFET modules with a new aluminum-nitride (AIN) ceramic. The devices come in half-bridge configuration with an on-state resistance (R DS(on)) of 11 mΩ in an EasyDUAL 1B package and 6 mΩ in an EasyDUAL 2B package. With high-performance ceramic, the 1200 V devices are suitable for high-power…

Infineon Technologies AG最近推出了Xensiv IM67D130A，以满足对汽车应用的高性能，低噪声MEMS麦克风的需求。Xensiv IM67D130A是市场上第一个有资格获得汽车应用程序的麦克风，这将有助于简化行业的设计工作，并减少资格的风险失败。麦克风…

In applications where MOSFETs are switched at a low frequency, the high-power product designs must meet several key characteristics: They have to minimize conduction losses, provide optimal thermal behavior, and enable more compact and lighter systems — while maintaining the highest quality at a low cost. To meet these requirements, Infineon Technologies AG is enhancing…

Infineon Technologies has announced the availability of its second-generation, non-volatile Static RAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments. This includes in aerospace and industrial applications. The 256 kb STK14C88C and 1 Mb STK14CA8C nvSRAMs are…

Trusted Platform Modules (TPM) enable secure and remote software updates, disc encryption, and user authentication — meaning they’re crucial for connected industrial, automotive, and other embedded devices. To further facilitate seamless integration in Linux-based systems, Infineon Technologies AG now provides its latest OPTIGA TPM 2.0 solution with a comprehensive TSS host software, implementing the latest…

数字化在生活的各个领域都在加速。从家庭娱乐到卫生技术再到车内娱乐活动，房屋中使用的连接消费设备的数量继续加速，从而增加了对无线连接的需求。借助新的Airoc Wi-Fi 6/6e和蓝牙5.2产品系列，Infineon Technologies AG正在对消费者的反应……

In a joint project, Infineon Technologies AG and DIGISEQ, an IoT platform provider with end-to-end service, will use SECORA Blockchain NFC technology to deliver secured identity data. This advanced solution connects the digital data recorded and a blockchain to the physical item, allowing for comprehensive verification of the identity of items – essentially, eliminating the…

Infineon Technologies AG has launched a 650 V CoolSiC Hybrid IGBT portfolio in a discrete package with 650 V blocking voltage. The CoolSiC hybrid product family combines key benefits of the 650 V TRENCHSTOP 5 IGBT technology and unipolar structure of the co-packed Schottky barrier CoolSiC diodes. With superior switching frequencies and reduced switching losses,…

Infineon Technologies AG is broadening its EiceDRIVER portfolio with the new 24 V dual-channel, low-side gate driver with an integrated thermal pad. It can be operated with high-switching frequencies and the highest peak output currents, with an enable function. The new gate driver is suitable for applications with higher switching frequencies such as power factor…

Infineon Technologies正在其AM Campeon总部替换员工ID卡，其中包括世界上第一个解决方案，该解决方案将高度安全的Office Building Access与灵活的，无接触的万事达卡支付功能结合在一起。为了将付款直接集成在智能卡上，Infineon正在与万事达卡，PayCenter GmbH和Petafuel GmbH合作。总部位于慕尼黑的半导体…

According to research consultancy, Omdia, Infineon Technologies AG has successfully positioned itself as a market leader for MEMS microphones. Based on MEMS chip unit sales, the market share was reported to hit a staggering 43.5 percent. This positions Infineon at the top, with a lead of almost four percent over second place and more than…

Infineon Technologies AG and GT Advanced Technologies (GTAT) have signed a supply agreement for silicon carbide (SiC) boules. The contract has an initial term of five years. With this supply contract, the German semiconductor manufacturer adds another element to secure its growing base material demand in this area. SiC is the basis for power semiconductors…

Infineon Technologies AG为其广泛使用，最简单的Eicedriver 1ED紧凑型隔离式驱动器家族而增加了新一代：X3紧凑型（1ED31XX）家族。该门驱动程序提供单独的输出选项，并在DSO-8 300万包中使用主动关闭和短路夹具。主动磨坊主夹选项非常适合硅…

世界上越来越多的人不接触式支付，因为这是轻松，快速和卫生的，尤其是在电晕大流行之后。除了自动柜员机或信用卡外，所谓的可穿戴设备的需求也很高。现在，它首次可以配备由…制成的金属制成的传统手表或豪华型号。

Infineon Technologies AG is expanding its XENSIV 3D magnetic sensor family TLx493D. During the company’s in-house digital trade show, “Virtual Sensor Experience,” it will present a new device for industrial and consumer applications: the TLI493D-W2BW. This latest offering uses 3D Hall generation from Infineon and is housed in an extremely small wafer-level package. With an…

英飞凌科技公司正在扩大其产品offering for battery management systems with a new sensing and balancing IC: the TLE9012AQU. The device is especially designed for batteries in hybrid and electric cars, but it is also suitable for other applications. The TLE9012AQU measures the voltage in up to 12 battery cells with an accuracy of ±…

Infineon Technologies开发了世界上第一个完全独立的Raspberry Pi音频放大器帽子（顶部连接的硬件）。它在小型尺寸的繁荣盒功率水平上提供高清音频。Infineon专有的多层技术可确保覆盆子的最小尺寸和消耗量，最先进的功率效率以及高清音频质量…

The research project OpenLicht, which initially launched in September 2016, stands for the design of smart, customized light solutions that are based on open-source and new materials. OpenLicht was funded by the German Ministry of Education and Research (BMBF), with the goal of enabling new forms of collaboration between science, business, maker and startup community.…

Infineon Technologies AG is focusing on system innovation with enhancements at the component level by addressing the challenges of modern power management designs. The Source Down is a new industry standard packaging concept. The first wave of power MOSFETs launched in this new package is the OptiMOS 25 V in a PQFN 3.3×3.3 mm. The…